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Liquid Hot Melt Adhesive for Packaging Wood Electronics

Shenzhen KangLiBang Technology Co., Ltd
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Liquid Hot Melt Adhesive for Packaging Wood Electronics

Brand Name : kanglibang

Model Number : Kl-108

Place of Origin : china

MOQ : 1000

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Product Description
Liquid Hot Melt Adhesive for Packaging Wood Electronics
Products Description
This product is a modified hot melt adhesive synthesized from special resins. It can be applied to PET, PVC, PU, TPU, ABS, fabric,
leather and other substrates. It has no stickiness at room temperature. When subjected to high temperature and pressure, it can be
thermally bonded to various materials. It has the advantages of wide application range and strong adhesion.
Application
Liquid Hot Melt Adhesive for Packaging Wood Electronics
Specification
Name
KL-108 Hot Melt Adhesive
Appearance
Colorless clear liquid
Main Raw Material
Special resin
Viscosity
500 ± 200 cps
Solid Content
32 ± 3%
Coating thickness
5 μm / 10 μm / 20 μm
Hard drying time
2 min / 4 min / 7 min
Storage condition
0–15℃, avoid heat and direct sunlight
Operating Steps
Liquid Hot Melt Adhesive for Packaging Wood Electronics

1. Ensure the substrate surface is clean, dust-free, and oil-free.
2. Apply/screen print/spray the adhesive onto the substrate.

3.Bake at 90-110 degrees Celsius for 1-2 minutes to evaporate solvents or moisture.

4. A: Roll up (with cooling rollers) ☞ Apply release film ☞ For sale/Laminate within 6 months
B: Lamination: Hot pressing (100-170 degrees Celsius for 1 minute) ☞ Curing (175 degrees Celsius for 40 minutes / 50-60 degrees
Celsius for 24 hours)

5. After standing for 24 hours, conduct relevant tests.

Liquid Hot Melt Adhesive for Packaging Wood Electronics
Packing & Delivery
Liquid Hot Melt Adhesive for Packaging Wood Electronics
Liquid Hot Melt Adhesive for Packaging Wood Electronics

To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
FAQ (Frequently Asked Questions)
Q1: What type of product is KL-108 modified hot melt adhesive?
A1: KL-108 is a modified hot melt adhesive. It is liquid or semi-solid at room temperature and melts upon heating for bonding
applications.

Q2: What materials can KL-108 bond?
A2: It is suitable for bonding wood, paper, fabric, some plastics (e.g., ABS, PC), metal, leather, and more.

Q3: What is the recommended application temperature for KL-108?
A3: The recommended temperature range is 120–180°C, which can be adjusted based on equipment and substrate.

Q4: How fast does KL-108 cure?
A4: It has a fast setting time, typically initial curing within a few to tens of seconds, with full curing achieved in 24 hours.

Q5: Is KL-108 environmentally friendly? Does it have strong odor?
A5: Yes, it is solvent-free, low odor, and complies with common environmental standards such as RoHS and REACH (test reports
available upon request).

Our Service
Sample Provide
OEM Service(Custom Service)
Technical Support
And Efficient Production Team, Timely Delivery
Contact


Contact person: Renee Ho

Tel/Wechat:+86 13727376764

Email: info@bondsil.com

Product Tags:

hot melt adhesive for packaging

      

liquid adhesive for wood bonding

      

electronics hot melt adhesive

      
Quality Liquid Hot Melt Adhesive for Packaging Wood Electronics for sale

Liquid Hot Melt Adhesive for Packaging Wood Electronics Images

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